Thermal Modeling and Characterization of Nanoscale Metallic Interconnects
نویسندگان
چکیده
ACKNOWLEDGEMENTS I would like to thank my committee members Drs. I couldn't have finished my work without the help of my lab members, in par-thoroughly enjoyed my stay at Georgia Tech with other lab members. I would like to thank my parents and sister who made so many sacrifices to help me achieve my goals. Without their support I could not dream to reach this juncture in my life. I would also like to thank my dear friends Sasi and Reddy for their personal support.
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